1. http://www.ridgetopgroup.com/products/advanced-diagnostics-and-prognostics/
2. https://www.sbir.gov
3. AF161-142: https://www.sbir.gov/sbirsearch/detail/870421 —Integrated Circuit (IC) Die Extraction and Reassembly
4. Electronic Circuits-Preserving Technique for Decapsulating Plastic Packages. 1987. IBM Technical Disclosure Bulletin 30(6), 446–447 (1987)
5. United States Patent 6,429,028, 6 August 2002 DPA Labs, Incorporated (Simi Valley, CA)