Split Manufacturing-Reference-Cited by-同舟云学术

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Split Manufacturing

Published:2017 Issue: Volume: Page:243-262
ISSN:
Container-title:Hardware Protection through Obfuscation
language:
Short-container-title:

Author:

Garg Siddharth,Rajendran Jeyavijayan

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-319-49019-9_10

Reference25 articles.

1. Intelligence Advanced Research Projects Activity. Trusted Integrated Circuits Program

2. Vaidyanathan K, Das BP, Sumbul E, Liu R, Pileggi L (2014) Building trusted ics using split fabrication. In: IEEE international symposium on hardware-oriented security and trust (HOST), 2014. IEEE, pp 1–6

3. Goplen B, Spatnekar S (2007) Placement of 3d ics with thermal and interlayer via considerations. In: Proceedings of the 44th annual design automation conference. ACM, pp 626–631

4. Rajendran J, Sinanoglu O, Karri R (2013) Is split manufacturing secure? In: Proceedings of IEEE/ACM conference on design automation and test in Europe, pp 1259–1264

5. Selvakkumaran N, Karypis G (2006) Multiobjective hypergraph-partitioning algorithms for cut and maximum subdomain-degree minimization. IEEE Trans Comput-Aid Des Integr Circuits Syst 25(3):504–517

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Making a Case for Logic Locking;Understanding Logic Locking;2023-06-26

2. Analog IP Protection and Evaluation;Emerging Topics in Hardware Security;2020-11-10

3. Practical Split Manufacturing Optimization;A Synergistic Framework for Hardware IP Privacy and Integrity Protection;2020

4. Classical Cryptanalysis Attacks on Logic Locking Techniques;Journal of Electronic Testing;2019-10

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