Author:
Ralph W. Carter,Daspit Gregory L.,Cain Andrew W.,Benedetto Elizabeth E.,Jenkins Randall S.,Allen Aileen M.,Newman Keith
Publisher
Springer International Publishing
Reference5 articles.
1. Reinosa R (2010) Characterizing mechanical performance of board level interconnects for in-circuit test. In test conference (ITC), Austin, 2–4 Nov 2010
2. Hsieh G (2005) Flip chip ball grid array component testing under board flexure. ECTC ’05, Orlando, FL, pp 937–944, 31 May–3 June, 2005
3. Morscher G (1998) Modal acoustic emission of damage accumulation in a woven SiC/SiC composite. Compos Sci Technol 59(1999):687–697
4. Ralph W (2013) Acoustic emission detection of BGA components in spherical bend. ECTC ’13, Las Vegas, pp 208–213, NV, 28–31 May 2013
5. Szabo T (1994) Time domain wave equations for lossy media obeying a frequency power law. J Acoust Soc Am 96(1):491–500
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献