Die Attach Adhesives and Films-Reference-Cited by-同舟云学术

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Die Attach Adhesives and Films

Published:2016-11-19 Issue: Volume: Page:469-510
ISSN:
Container-title:Materials for Advanced Packaging
language:
Short-container-title:

Author:

Takeda Shinji,Masuko Takashi,Takano Nozomu,Inada Teiichi

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-319-45098-8_11

Reference67 articles.

1. Kayama S, Tanimoto M, Uchida S, Tsukada H, Suto T (1992) ASIC packaging technology handbook. Science Forum

2. Hagimoto E (1997) CSP technology. Kogyochosakai, Tokyo

3. Kasuga T (1998) CSP/BGA technology. Nikkan Kogyo Shinbunsha, Tokyo

4. Dotani A (2003) Semicon Japan 2003 navigator. Nikkei Microdev 49(2003)

5. Asakura H (1999) Nikkei Microdev 4:74

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Visualization, transformation, and analysis of execution traces with the eclipse TRACE4CPS trace tool;International Journal on Software Tools for Technology Transfer;2024-02

2. High performance electrically conductive epoxy/reduced graphene oxide adhesives for electronics packaging applications;Journal of Materials Science: Materials in Electronics;2019-01-14

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