Application I: Solder Joint Reflow Process
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-00092-3_5
Reference10 articles.
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4. Rooney, D.T., Castello, N.T., Cibulsky, M., Abbott, D., Xie, D.: Materials characterization of the effect of mechanical bending on area array package interconnects. Microelectron. Reliab. 44(2), 275–285 (2004)
5. Sarihan, V.: Temperature dependent viscoplastic simulation of controlled collapse solder joint under thermal cycling. ASME Trans. J. Electron. Packag. 115(1), 16–21 (1993)
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