Empathy, Design and Human Factors

Author:

Woodcock Andree,McDonagh Deana,Osmond Jane,Scott Wesley

Publisher

Springer International Publishing

Reference37 articles.

1. Zwillinger, B.: The Number One Quality to Have as a Human Factors Engineer (2017). http://blog.cambridgeconsultants.com/medical-technology/the-number-one-quality-to-have-as-a-human-factors-engineer/

2. Kolko, J.: Well Designed: How to Use Empathy to Create Products People Love. Harvard Business Review Press, Boston (2014)

3. Algra, H.R., Johnston, C.R.: Encouraging empathy in engineering design. In: Proceedings of CEEA 15, Paper 169, McMaster University, 31 May – 3 June (2015)

4. McDonagh D.: Empathic Research Approaches to Support the Designer: A Supra-Qualitative Research for Designing Model. Design Issues (2006)

5. Carkhof, R.: Helping and Human Relationships. Holt Rinehart and Winston, New York (1969)

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Supporting Service Recipients to Navigate Complex Service Systems: An Interdisciplinary Scoping Review;Health & Social Care in the Community;2023-10-19

2. Blurring boundaries: Toward the collective empathic understanding of product requirements;Information and Software Technology;2021-12

3. Functional Organization of Software Groups Considered Harmful;2019 IEEE/ACM International Conference on Software and System Processes (ICSSP);2019-05

4. Blurring Boundaries;Lecture Notes in Business Information Processing;2019

5. Cross-Functional Teams That Grok It: The Collective Empathic Understanding of Product Requirements;2018 IEEE 26th International Requirements Engineering Conference (RE);2018-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3