Removal of Defective Products Using Robots

Author:

Singh Birender,Chandra Mahesh,Kandru Nikitha

Publisher

Springer International Publishing

Reference12 articles.

1. Chang, C.-Y., Lin, S.-Y., Jeng, M.: Using a Two-layer Competitive Hopfield Neural Network for Semiconductor Wafer Defect Detection. In: Proceedings of the IEEE International Conference on Automation Science and Engineering, Edmonton, Canada, August 1-2, pp. 301–306 (2005)

2. Robinson, A.P., Lewin, P.L., Swingler, S.G.: Detection of Manufacturing Defects in Polymeric Cable Joint Insulation using X-rays. In: Conference Record of the IEEE International Symposium on Electrical Insulation, pp. 34–37 (2006)

3. Priya, S., Kumar, T.A., Paul, V.: A Novel Approach to Fabric Defect Detection Using Digital Image Processing. In: Proceedings of International Conference on Signal Processing, Communication, Computing and Networking Technologies (ICSCCN 2011), pp. 228–232 (2011)

4. Clement, W.I.: An Instructional Robotics and Machine Vision Laboratory. IEEE Transactions on Education 37(I), 87–90 (1994)

5. Garcia, G.J., Pomares, J., Torres, F.: Automatic robotic tasks in unstructured environments using an image path tracker. Control Engineering Practice 17, 597–608 (2009)

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