Author:
Negrub Maryana M.,Hélie David,Yurgelevych Iryna V.,Poperenko Leonid V.
Publisher
Springer International Publishing
Reference9 articles.
1. Plobl, A., Krauter, G.: Wafer direct bonding: tailoring adhesion between brittle materials. Mater. Sci. Eng. R 25, 1–88 (1999)
2. Krauter, G., Schumacher, A., Gosele, U.: Low temperature silicon direct bonding for application in micromechanics: bonding energies for different combination of oxides. Sens. Actuators A 70, 271–275 (1998)
3. Hunt, C.E., Desmond, C.A., Ciarlo, D.R., Bennett, W.J.: Direct bonding of micromachined silicon wafers for laser diode heat exchanger applications. J. Micromech. Microeng. 1(3), 152–156 (1991)
4. Hélie, D., Lacroix, F., Vallée, R.: Reinforced direct bonding of optical materials by femtosecond laser welding. Appl. Opt. 51(12), 2098–2106 (2012)
5. Hélie, D., Lacroix, F., Vallée, R.: Reinforcing a direct bond between optical materials by filamentation based femtosecond laser welding. JLMN-J. Laser Micro/Nanoeng. 7(3), 163–169 (2012)