Author:
Ekwińska Magdalena A.,Bieniek Tomasz,Janczyk Grzegorz,Wąsowski Jerzy,Janus Paweł,Grabiec Piotr,Głuszko Grzegorz,Zajac Jerzy,Tomaszewski Daniel,Wojciechowska Karina,Dobrowolski Rafał,Budzyński Tadeusz
Publisher
Springer International Publishing
Reference15 articles.
1. Scheeper P. R., Nordstrand B., Gullov J. O., Bin L.., Clausen T., Midjord L., Storgaard-Larsen T., A new Measurement Microphone Based on MEMS Technology” Jurnal of Microelectromechanical systems , Vol 12, No 6, pp.880 – 891 (2003)
2. Torkkeli A., Rusanem O., Saarilahti J., Seppa H., Sipola H., Hietanen J., Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate, Sensors and Actuators A, Physical 01/2000 (2000)
3. Hsu P. C., Mastrangelo H. C., Wise K. D., A high sensitivity polysilicon diaphragm condenser microphone, in Digest Tech. Papers IEEE MEMS 1998, pp.580-585
4. Bergqvist J., Rudolf F., Silicon A Condenser Microphone Using Bond and Etch-back Technology, Sensors and Actuators A 45, pp. 115 – 124 (1994)
5. Ning Y. B., Mitchell A. W., Tait R. N., Fabrication of silicon micromachined microphone using a dry-etch process, Sensors and Actuators A 53, pp. 237 – 242 (1996)
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献