Monolithic 3D Integration
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-22093-2_3
Reference43 articles.
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4. Batude, P. et al.: Direct bonding: a key enabler for 3D monolithic integration. In: Proceedings of the Electro-Chemical Society (ECS) spring meeting, vol. 16, pp. 47 (2008)
5. Rajendran, B.: Pulsed laser annealing: a scalable and practical technology for monolithic 3D IC. In: IEEE 3DIC Conference (2013)
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1. Organic substrate high-voltage performance: plausible capacitive isolation technology in integrated circuit package bill of materials;Electrical Engineering;2019-09
2. 3D integration advances computing;Nature;2017-07
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