Exploring Barriers in Current Inter-enterprise Collaborations: A Survey and Thematic Analysis-Reference-Cited by-同舟云学术

Exploring Barriers in Current Inter-enterprise Collaborations: A Survey and Thematic Analysis

Published:2018 Issue: Volume: Page:319-327
ISSN:1865-1348
Container-title:Lecture Notes in Business Information Processing
language:
Short-container-title:

Author:

Kazantsev Nikolay^ORCID,Pishchulov Grigory^ORCID,Mehandjiev Nikolay^ORCID,Sampaio Pedro^ORCID

Publisher

Springer International Publishing

Link

http://link.springer.com/content/pdf/10.1007/978-3-319-94214-8_23

Reference16 articles.

1. Braun, V., Clarke, V.: Using thematic analysis in psychology. Qual. Res. Psychol. 3(2), 77–101 (2006)

2. Brettel, M., Friederichsen, N., Keller, M., Rosenberg, M.: How virtualization, decentralization and network building change the manufacturing landscape: an Industry 4.0 perspective. Int. J. Mech. Ind. Sci. Eng. 8(1), 37–44 (2014)

3. Broft, R., Badi, S.M., Pryke, S.: Towards supply chain maturity in construction. Built Environ. Proj. Asset Manag. 6(2), 187–204 (2016)

4. IFIP Advances in Information and Communication Technology;S Cisneros-Cabrera,2017

5. Glock, C.H., Grosse, E.H., Ries, J.M.: Decision support models for supplier development: systematic literature review and research agenda. Int. J. Prod. Econ. 193, 798–812 (2017)

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. From supply chains towards manufacturing ecosystems: A system dynamics model;Technological Forecasting and Social Change;2023-12

2. The architectural design and implementation of a digital platform for Industry 4.0 SME collaboration;Computers in Industry;2022-06

3. Investigating barriers to demand-driven SME collaboration in low-volume high-variability manufacturing;Supply Chain Management: An International Journal;2022-02-08

4. Industry 4.0 Digital Platforms: Collaborative Business Models for SMEs;Digital Business Models in Industrial Ecosystems;2021

5. The Research Trends of Partnership Based on Scientific Publications;2019 IEEE Conference of Russian Young Researchers in Electrical and Electronic Engineering (EIConRus);2019-01