Line Tension of Grain Boundary Triple Junctions in the Copper Tricrystals
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Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-319-48237-8_126
Reference15 articles.
1. Czubayko, U., et al., Influence of triple junctions on grain boundary motion. Acta Materialia, 1998. 46(16): p. 5863–5871.
2. Upmanyu, M., et al., Triple junction mobility: A molecular dynamics study. Interface Science, 1999. 7(3–4): p. 307–319.
3. Upmanyu, M., et al., Molecular dynamics simulation of triple junction migration. Acta Materialia, 2002. 50(6): p. 1405–1420.
4. Lefevre-Schlick, F., et al., On the activation of re crystallization nucleation sites in Cи and Fe. Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2009. 502(1–2): p. 70–78.
5. King, A.H., Triple lines in materials science and engineering. Scripta Materialia, 2010. 62(12): p. 889–893.
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