Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced with Single-Wall Carbon Nanotubes

Author:

Mohan Kumar K.,Kripesh Vaidyanathan,Tay Andrew A. O.

Publisher

Springer International Publishing

Reference42 articles.

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3. Yeth CC, Choi WJ, Tu KN (2002) Current-crowding-induced electromigration failure in flip chip solder joints. Appl Phys Lett 80:580

4. Lau JH (1997) Flip chip technologies. McGraw Hill, New York

5. Stam FA, Davitt E (2001) Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints. Microelectron Reliab 41:1815

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1. An Introduction to Nanomaterials for Nanopackaging;IEEE Nanotechnology Magazine;2024-04

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