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Springer International Publishing
Reference64 articles.
1. Palmer DW, Benson DA, Peterson DW, Sweet JN (1998) IC chip stress during plastic package molding. In: Proc. electronic components and technology conference (ECTC), pp 1326–1331
2. Sweet JN, Tuck MR, Peterson DW Palmer DW (1990) Short and long loop manufacturing feedback using multi-sensor assembly test chip. In: Proceedings of IEEE/CHMT international electronics manufacturing symposium, pp 229–235
3. Oprins H, Cherman V, Van der Plas G, Maggioni F, De Vos J, Wang T, Daily R, Beyne E (2015) Experimental thermal characterization and thermal model validation of 3D packages using a programmable thermal test chip. In: Proceedings of 65th IEEE electronic components and technology conference (ECTC), https://doi.org/10.1109/ECTC.2015.7159737
4. Morris JE, Radehaus C, Hietschold M, Kiesow A, Wu F (2004) Single electron transistors & discontinuous thin films. In: Michel B, Aschenbrenner R (eds) The world of electronic packaging and system integration. dpp goldenbogen, Dresden, pp 84–93
5. Morris JE, Wu F, Radehaus C, Hietschold M, Henning A, Hofmann K, Kiesow A (2004) Single electron transistors: modeling and fabrication. (Invited) 7th International conference solid state & integrated circuit technology (ICSICT), Beijing, 19–21 Oct, pp 634–639
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