Three-Dimensional Molded Interconnect Devices (3D-MID)-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Three-Dimensional Molded Interconnect Devices (3D-MID)

Published:2014 Issue: Volume: Page:
ISSN:
Container-title:
language:
Short-container-title:

Author:

Franke Jörg

Publisher

Carl Hanser Verlag GmbH & Co. KG

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics;Micromachines;2023-12-16

3. Injection Compression Molding of LDS-MID for Millimeter Wave Applications;Journal of Manufacturing and Materials Processing;2023-10-13

4. Study for implementation of electronic circuits into multifunctional miniaturized thermoplastic enclosures;2023 15th International Congress Mechatronic Integration Discourse (MID);2023-06-21

5. Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication;2023 15th International Congress Mechatronic Integration Discourse (MID);2023-06-21

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP