A bond failure mechanism for adhesive on a metal substrate-Reference-Cited by-同舟云学术

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A bond failure mechanism for adhesive on a metal substrate

Published:1968-02 Issue:2 Volume:222 Page:148-157
ISSN:0023-2904
Container-title:Kolloid-Zeitschrift und Zeitschrift für Polymere
language:en
Short-container-title:Kolloid-Z.u.Z.Polymere

Author:

Peterson Clarke M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Colloid and Surface Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry

Link

http://link.springer.com/article/10.1007/BF01510798/fulltext.html

Reference23 articles.

1. Weiss, P., ed., Adhesion and Cohesion. Proceedings of the Symposium on Adhesion and Cohesion, General Motors Research Laboratories (Warren, Michigan, 1961) (Elsevier Publishing Company, New York, 1962).

2. Ilkka, G. A. andR. L. Scott, p. 65

3. Reegan. S. L. andG. A. Ilkka, p. 159

4. Bikerman, J. J., p. 36

5. Engel, J. H., Jr., andR. N. Fitzwater, p. 99 (discussion).

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A study of adhesive bonding in metal–metal, metal–CFRP, and CFRP–CFRP material combinations under shear deformation: Fracture morphologies and damage mechanisms;International Journal of Adhesion and Adhesives;2023-10

2. Rheology of Film-Forming Liquids;ACS Symposium Series;1985-07-23

3. Structure-Property-Performance Relationships in Synthetic Polymeric Adhesives;Adhesion Science and Technology;1975

4. Coupling Agents as Adhesion Promoters;Journal of Macromolecular Science: Part D - Reviews in Polymer Processing;1971-01

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