A Non-Contact Varying Temperature Strain Measuring System Based on Digital Image Correlation
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://link.springer.com/content/pdf/10.1007/s40799-016-0014-z.pdf
Reference9 articles.
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3. Grant, B.M.B., Stone, H.J., Withers, P.J., et al., “High-Temperature Strain Field Measurement Using Digital Image Correlation”, Journal of Strain Analysis for Engineering Design 44(4): 263–271 (2009).
4. Lyons, J.S., Liu, J., and Sutton, M.A., “High-Temperature Deformation Measurement Using Digital Image Correlation”, Experimental Mechanics 36(1): 64–70 (1996).
5. Pan, B., Dafang, W., and Xia, Y., “High-Temperature Deformation Field Measurement by Combining Transient Aerodynamic Heating Simulation System and Reliability-Guided Digital Image Correlation”, Optics and Lasers in Engineering 48: 841–848 (2010).
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