Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy-Reference-Cited by-同舟云学术

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Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy

Published:2002-07 Issue:7 Volume:33 Page:2163-2172
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Li Wen-Chung,Lin Shun-Tian,Liang Cheng

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-002-0048-y.pdf

Reference40 articles.

1. J.T. Lowder, R.F. Wielonski, and K.L. George: U.S. Patent 5,492,771, Feb. 20, 1996.

2. R.M. Andrews, B.J. Miller, M.R. Skeem, and R.K. Shiue: U.S. Patent, 5,832,360, Nov. 3, 1998.

3. R.K. Shiue, S.T. Buljan, B.J. Miller, E. Schulz, and T.W. Eagar: U.S. Patent, 5,855,314, Jan. 5, 1999.

4. R.K. Shiue, S.T. Buljan, and T.W. Eagar: Sci. Technol. Welding Joining, 1997, vol. 2, pp. 71–78.

5. A.K. Chattopadhyay, L. Chollet, and H.E. Hintermann: J. Mater. Sci., 1991, vol. 26, pp. 5093–5100.

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