Fast Isothermal Solidification During Transient Liquid Phase Bonding of a Nickel Alloy Using Pure Copper Filler Metal: Solubility vs Diffusivity
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanics of Materials,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s11661-019-05149-5.pdf
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