Diffusion bonding of Si3N4-TiN composite with nickel-based interlayers-Reference-Cited by-同舟云学术

Diffusion bonding of Si3N4-TiN composite with nickel-based interlayers

Published:2003-08 Issue:8 Volume:34 Page:1627-1636
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Deschaux-Beaume F.,Frety N.,Colin C.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-003-0308-5.pdf

Reference32 articles.

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3. M. Higuchi, M. Miyake, H. Kakeuchi, and E. Kamjo: U.S. Patent 4, 659, 508, 1987.

4. C. Martin, P. Mathieu, and B. Cales: Proc. Symp. on Ceramic Materials Research, E-MRS Spring Conf., R.J. Brook, Strasbourg, 1988, ed., Elsevier, Amsterdam, 1989, pp. 107–11.

5. A. Bellosi, S. Guicciardi, and A. Tampieri: J. Eur. Ceram. Soc., 1992, vol. 9, pp. 83–93.

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