1. J.-C. Zhao and J.H. Westbrook: MRS Bull., 2003, vol. 28 (9), p. 622 ff.
2. J.H. Schneibel, P.F. Tortorelli, M.J. Kramer, A.J. Thom, J.J. Kruzic, and R.O. Ritchie: MRS Symposium Proceedings, E.P. George, M.J. Mills, H. Inui, and G. Eggeler, eds., Materials Research Society, Warrendale, PA, 2003, vol. 753, pp. BB2.2.1-BB2.2.6.
3. D.M. Berczik: U.S. Patent No. 5,595,616, United Technologies Corp., East Hartford, CT, 1997.
4. D.M. Berczik: U.S. Patent No. 5,693,156, United Technologies Corp., East Hartford, CT, 1997.
5. C.A. Nunes, R. Sakidja, and J.H. Perepezko: in Structural Intermetallics, 1997, M.V. Nathal, R. Darolia, C.T. Liu, P.L. Martin, D.B. Miracle, R. Wagner, and M. Yamaguchi, eds., TMS, Warrendale, PA, 1997, pp. 831–39; also J.H. Perepezko, University of Wisconsin-Madison, Madison, WI, private communication, 2004.