The Effects of Composition and Microstructure on the Thermal Conductivity of Liquid-Phase-Sintered W-Cu-Reference-Cited by-同舟云学术

The Effects of Composition and Microstructure on the Thermal Conductivity of Liquid-Phase-Sintered W-Cu

Published:2010-04-07 Issue:6 Volume:41 Page:1564-1572
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Johnson John L.,Park Seong Jin,Kwon Young-Sam,German Randall M.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-010-0210-x.pdf

Reference51 articles.

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2. W. Neumann and E. Kny: Proc. 12th Int. Plansee Seminar, H. Bildstein and H.M. Ortner, eds., Metallwerk Plansee, Reutte, Austria, 1989, vol. 4, pp. 113–37.

3. M. Osada, Y. Amano, N. Ogasa, and A. Ohtsuka: U.S. Patent 5,086,333, Feb. 4, 1992.

4. Y. Bin and R.M. German: Int. J. Powder Metall., 1997, vol. 33 (4), pp. 55–63.

5. W.S. Wang and K.S. Hwang: Metall. Mater. Trans. A, 1998, vol. 29A, pp. 1509–16.

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