Microstructural Investigation of the Impact Weld Interface of Pseudo Single Grained Cu and Ag-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Microstructural Investigation of the Impact Weld Interface of Pseudo Single Grained Cu and Ag

Published:2019-11-26 Issue:2 Volume:51 Page:558-561
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall Mater Trans A

Author:

Lee Taeseon,Zhu Menglin,Dittrich Taylor,Hwang Jinwoo,Vivek Anupam,Daehn Glenn S.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-019-05557-7.pdf

Reference17 articles.

1. T. Blazynski: Explosive Welding, Forming and Compaction, England, 1983.

2. T. Lee, S. Zhang, A. Vivek, B. Kinsey, and G. Daehn: J. Manuf. Sci. Eng., 2018, vol. 140, pp. 121002.

3. A. Nassiri, A. Vivek, T. Abke, B. Liu, T. Lee, and G. Daehn: Appl. Phys. Lett., 2017, vol. 110, pp. 231601.

4. I. Bataev, D. Lazurenko, S. Tanaka, K. Hokamoto, A. Bataev, Y. Guo, and A. Jorge: Acta Mater., 2017, vol. 135, pp. 277-289.

5. Z. Fan, H. Yu, and C. Li: Scr. Mater., 2016, vol. 110, pp. 14-18.

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on magnetic pulse spot welding process for AA5052 aluminium alloy;Journal of Manufacturing Processes;2023-09

2. Microstructure complexities of laser impact welded Al-Ti bonding interface;Scripta Materialia;2022-04

3. Formation of Refined Grain Size Less Than 5 nm and Nano-sized Undulations in the Bonding Interface Region of an Ultrasonic Spot Welded Cu/Ni Joint;Metallurgical and Materials Transactions A;2020-09-16

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3