Microstructure Evolution During Al, Ti, and Mo Surface Deposition and Volume Diffusion in Ni-20Cr Wires and Woven Structures
Author:
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanics of Materials,Condensed Matter Physics
Link
http://link.springer.com/content/pdf/10.1007/s11661-015-2794-7.pdf
Reference27 articles.
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