Author:
Cox M. J.,Carpenter R. W.,Kim M. J.
Publisher
Springer Science and Business Media LLC
Subject
Metals and Alloys,Mechanics of Materials,Condensed Matter Physics
Reference16 articles.
1. M.F. Islam and N. Ridley: Scripta Mater., 1998, vol. 38 (8), pp. 1187–93.
2. H. Kokawa, T. Tsuzuki, and T. Kuwana: Iron Steel Inst. Jpn. Int., 1995, vol. 35 (10), pp. 1291–97.
3. Q.-Y. Tong and U. Gosele: Semiconductor Wafer Bonding, John Wiley & Sons, Inc., New York, NY, 1999.
4. B. Derby and E.R. Wallach: Met. Sci., 1982, vol. 16, pp. 49–56.
5. Y. Takahashi and K. Inoue: Mater. Sci. Technol., 1992, vol. 8, pp. 953–64.
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献