Author:
Cheng Yuan-Qing,Zhang Lei,Han Yin-He,Li Xiao-Wei
Publisher
Springer Science and Business Media LLC
Subject
Computational Theory and Mathematics,Computer Science Applications,Hardware and Architecture,Theoretical Computer Science,Software
Reference25 articles.
1. Davis J A, Venkatesan R, Kaloyeros A et al. Interconnect limits on gigascale integration (GSI) in the 21st century. Proceedings of the IEEE, 2001, 89(3): 305-324.
2. Lewis D L, Lee H H S. Test circuit-partitioned 3D IC designs. In Proc. ISVLSI, May 2009, pp.139-144.
3. Lee H-H S, Chakrabarty K. Test challenges for 3D integrated circuits. IEEE Design & Test of Computers, 2009, 26(5): 26-35.
4. Marinissen E J. Test challenges for 3D-SICs: All the old, most of the recent, and then some new! In Proc. ITC, Nov. 2009.
5. Marinissen E J, Arendsen R, Bos G et al. A structured and scalable mechanism for test access to embedded resuable cores. In Proc. ITC, Oct. 1998, pp.284-293.
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