The influence of head diameter and wall thickness on deformations of metallic acetabular press-fit cups and UHMWPE liners: a finite element analysis
Author:
Publisher
Elsevier BV
Subject
Orthopedics and Sports Medicine,Surgery
Link
http://link.springer.com/content/pdf/10.1007/s00776-012-0340-7
Reference32 articles.
1. Endoprothetik;Krukemeyer,2009
2. Load transfer and fixation mode of press-fit acetabular sockets;Widmer;J Arthroplast,2002
3. Orthopaedic crossfire—larger femoral heads: a triumph of hope over reason! In opposition;Maloney;J Arthroplast,2003
4. Comparison of the wear rates of twenty-eight and thirty-two-millimeter femoral heads on cross-linked polyethylene acetabular cups in a wear simulator;Hermida;J Bone Joint Surg Am,2003
5. Influence of femoral head size on impingement, dislocation and stress distribution in total hip replacement;Kluess;Med Eng Phys,2007
Cited by 37 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Computational nodal displacement analysis of acetabulum fossa for injection molded cemented polyethylene acetabular liner;Journal of the Mechanical Behavior of Biomedical Materials;2023-11
2. Enhancing acetabular reaming accuracy: optimal techniques and a novel reamer design;Journal of Orthopaedic Surgery and Research;2023-08-08
3. In vivo creep and wear performance of vitamin-E-diffused highly crosslinked polyethylene in total hip arthroplasty;Archives of Orthopaedic and Trauma Surgery;2023-07-12
4. Bio-tribological studies of Structalit/UHMWPE composites as an alternative to UHMWPE for hip joint application;Wear;2023-04
5. A Review on Finite Element Modelling and Simulation for Upper Limb of Human Bone and Implant;JANUARY 2023;2023-01-15
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3