Temperature-sensitive properties of gold and gold alloy electrodeposits-Reference-Cited by-同舟云学术

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Temperature-sensitive properties of gold and gold alloy electrodeposits

Published:1976-12 Issue:4 Volume:9 Page:123-128
ISSN:0017-1557
Container-title:Gold Bulletin
language:en
Short-container-title:Gold Bull

Author:

Raub Ch. J.,Khan H. R.,Lendvay J.

Publisher

Springer Science and Business Media LLC

Subject

Inorganic Chemistry,General Materials Science

Link

http://www.springerlink.com/index/pdf/10.1007/BF03215419

Reference14 articles.

1. Ch. J. Raub,Gold Bull., 1975,8, (3), 70

2. M. Antler, “Gold Plating Technology”, ed. F. H. Reid and W. Goldie, Electrochemical Publications Ltd., Ayr, Scotland, 1974, p. 483

3. Ch. J. Raub, A. Knödler and J. Lendvay,Plating Surf. Finish., 1976,63, (1), 35

4. T. A. Davies and P. Watson,Plating, 1973,60, (11), 1138

5. Ch. J. Raub, J. Lendvay and H. Weiss, unpublished work

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1. A Study of the Effect of Gold Thickness Distribution in the Jet Plating Process to Optimize Gold Usage and Plating Voltage Using Design of Experiments;MATEC Web of Conferences;2016

2. Das ausscheidungsverhalten goldreicher Au-Co-mischkristalle;Journal of the Less Common Metals;1981-06

3. On the formation of the ordered phases CuAu and Cu3Au at a copper/gold planar interface;Metallurgical Transactions A;1979-06

4. Diffusion-related behaviour of gold in thin film systems;Gold Bulletin;1979-06

5. The electrodeposition of gold by pulse plating;Gold Bulletin;1977-06

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