A Review of Various Defects in PCB
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering
Link
https://link.springer.com/content/pdf/10.1007/s10836-022-06026-7.pdf
Reference15 articles.
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3. Li YT, Kuo P, Guo JI (2020) Automatic industry PCB board dip process defect detection with deep ensemble method. In: 2020 IEEE 29th International Symposium on Industrial Electronics (ISIE), IEEE, pp 453–459
4. Hao W, Xianmin Z, Yongcong K, Gaofei O, Hongwei X (2013) Solder joint inspection based on neural network combined with genetic algorithm. Optik 124(20):4110–4116
5. Anitha D, Rao M (2019) SMT component inspection in PCBA’s using image processing techniques. International Journal of Innovative Technology and Exploring Engineering (IJITEE) 8(12):541–547
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