Cooling and Packaging of High-Power Diode Lasers-Reference-Cited by-同舟云学术

Cooling and Packaging of High-Power Diode Lasers

Published: Issue: Volume: Page:289-301
ISSN:
Container-title:Topics in Applied Physics
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Author:

Loosen Peter

Publisher

Springer Berlin Heidelberg

Link

http://link.springer.com/content/pdf/10.1007/3-540-47852-3_8.pdf

Reference5 articles.

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2. Verein Deutscher Ingenieure (ed.): VDI-Wärmeatlas (VDI, Düsseldorf 1984)

3. T. Ebert: Optimierung von Mikrokanalkühlern zur Steigerung der Ausgangsleistung von Hochleistungs-Diodenlasern, Dissertation RWTH Aachen, Aachen (1999)

4. T. Ebert, G. Treusch, P. Loosen, R. Poprawe: Photonics West 98, SPIE Proc. 3285, 25–29 (1998)

5. J. Jandeleit, N. Wiedmann, P. Loosen, R. Poprawe: Photonics West 99, SPIE Proc. 3626, 217–221 (1999)

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