Multiscale model of fatigue of collagen gels
Author:
Funder
National Institutes of Health
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Modelling and Simulation,Biotechnology
Link
http://link.springer.com/article/10.1007/s10237-018-1075-y/fulltext.html
Reference53 articles.
1. Abel J, Luntz J, Brei D (2013) Hierarchical architecture of active knits. Smart Mater Struct 22:125001
2. Abhilash AS, Baker BM, Trappmann B, Chen CS, Shenoy VB (2014) Remodeling of fibrous extracellular matrices by contractile cells: predictions from discrete fiber network simulations. Biophys J 107(8):1829–1840. https://doi.org/10.1016/j.bpj.2014.08.029
3. Aghvami M, Billiar KL, Sander EA (2016) Fiber network models predict enhanced cell mechanosensing on fibrous gels. J Biomech Eng 138(10):101006–101011
4. Andarawis-Puri N, Flatow EL (2011) Tendon fatigue in response to mechanical loading. J Musculoskelet Neuronal Interact 11:106–114
5. Andrews E, Gibson L, Ashby M (1999) The creep of cellular solids. Acta Mater 47(10):2853–2863. https://doi.org/10.1016/S1359-6454(99)00150-0
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