1. R.R. Tummala, “Ceramics and Glass-Ceramics in Electronic Packaging,” Electronic Packaging Materials Science V, ed. E.D. Lillie, R.H. Jaccodine, P. Ho and K. Jackson (Pittsburgh, PA: MRS, 1991), in press.
2. B.C. Johnson, “Overview of High Performance Packaging Materials,” ibid.
3. W. Werdecker and F. Aldinger, “Aluminum Nitride an Alternative Ceramic Substrate for High Power Applications in Microcircuits,” IEEE Trans. Components, Hybrids, and Manufacturing Technology, CHMT-7 (1984), pp. 399–404.
4. A.J. Blogett, “Microelectronic Packaging,” Scientific American, 249 (July 1983), pp. 86–97.
5. G.A. Slack, R.A. Tanzilli, R.O. Pohl and J.W. Vandersande, “The Intrinsic Thermal Conductivity of AIN,” J. Phys. Chem. Solids, 48 (1987), pp. 641–647.