1. M. Töpper, D. Tönnies, Microelectronic packaging, in: Semiconductor Fabrication Handbook, M. H. Geng (ed), McGraw-Hill, New York, 2005, pp. 21.1–21.54
2. Microelectronic Packaging Handbook, Part 1–3, R. Tummala, E. Rymaszewski, A. Klopfenstein (eds), Chapman & Hall, New York, 1997
3. Multichip Module Technology Handbook, P. Garrou, I. Turlik (eds), McGraw-Hill, New York, 1998
4. A. J. van Roosmalen, “There Is More Than Moore”, Proc. 5th Int. Con. on Mech. Sim. and Exp. in Microelectronics and MST, EuroSim2004
5. Ball Grid Array Technology, J. Lau (ed), McGraw-Hill, New York, 1995