Electronic Packaging Materials and Their Functions in Thermal Managements-Reference-Cited by-同舟云学术

Electronic Packaging Materials and Their Functions in Thermal Managements

Published:2010-11-29 Issue: Volume: Page:131-167
ISSN:1437-0387
Container-title:Advanced Materials for Thermal Management of Electronic Packaging
language:
Short-container-title:

Author:

Tong Xingcun Colin

Publisher

Springer New York

Link

http://link.springer.com/content/pdf/10.1007/978-1-4419-7759-5_3.pdf

Reference21 articles.

1. Ashby MF, Evans A, Fleck NA, Gibson LJ, Hutchinson JW, Wadley HNG (2000) Metal foams: a design guide. Butterworth-Heinemann, Boston.

2. Barcena J, Maudes J, Coleto J, Obieta I (2002) Novel copper/carbon nanofibers composites for high thermal conductivity electronic packaging. http://escies.org/GetFile?rsrcid=1691 . Accessed 9 March 2010.

3. Bezama RJ, Casey JA, Pavelka JB, Pomerantz GA (1999) Method of forming a multilayer electronic packaging substrate with integral cooling channels. US Patent 5870823.

4. Brown WD, Ulrich R (2006) Materials for microelectronic packaging. In: Ulrich RK, Brown WD (eds) Advanced electronic packaging, 2nd edn. Wiley, Hoboken.

5. Casson KL et al (1997) Multilayer electronic circuit having a conductive adhesive. US Patent 5688584.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Full-state feedback LQR with integral gain for control of induction heating of steel billet;Engineering Science and Technology, an International Journal;2024-07

2. Negative Thermal Expansion Metamaterials: A Review of Design, Fabrication, and Applications;Journal of Manufacturing and Materials Processing;2024-02-14

3. Morphological and mechanical evolution of α-Al2O3 reinforced Mo Cu alloy obtained by planetary ball milling;Journal of Manufacturing Processes;2023-10

4. Mechanical and morphological properties of carbon fibre and its composite for biomaterials’ application;Applied Nanoscience;2022-02-03

5. Numerical investigation of heat transfer in structured rough microchannels subjected to pulsed flow;Applied Thermal Engineering;2021-10