Design for High Performance, Low Power, and Reliable 3D Integrated Circuits-Reference-Cited by-同舟云学术

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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits

Published:2013 Issue: Volume: Page:
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Author:

Lim Sung Kyu

Publisher

Springer New York

Link

http://link.springer.com/content/pdf/10.1007/978-1-4419-9542-1.pdf

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Multi-Objective Optimization in 3D Floorplanning;Electronics;2024-04-27

2. Efficient implementation of a DSIG-JLT-based multiplexer and demultiplexer using different logic styles at 20-nm technology;Journal of Computational Electronics;2023-10-13

3. 3D SRAM Macro Design in 3D Nanofabric Process Technology;IEEE Transactions on Circuits and Systems I: Regular Papers;2023-07

4. Impedance modeling and analysis of multi-stacked on-chip power distribution network in 3D ICs;Journal of Computational Electronics;2022-09-16

5. Design of Power/Ground Noise Suppression Structures Based on a Dispersion Analysis for Packages and Interposers with Low-Loss Substrates;Micromachines;2022-08-30

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