1. R. R. Tummala, E. J. Rymaszewski, and A. G. Klopfenstein, “Microelectronics Packaging Handbook,” Chapman and Hall, New York, 2nd ed 1997, (now Kluwer), vol 1, ch. 1.
2. R. R. Tummala, “Fundamentals of Microsystems Packaging,” McGraw-Hill 2001.
3. Card courtesy of John MacWilliams/AMP.
4. C. S. Walker, “Capacitance, Inductance, and Crosstalk Analysis,” Artech House Inc., London 1990, ch. 4.
5. R. K. Poon, “Computer Circuits Electrical Design,” Prentice Hall, Eaglewood Cliffs 1995, ch. 8.