Author:
Chu Richard C.,Simons Robert E.,Iyengar Madhusudan,Yeh Lian-Tuu
Reference100 articles.
1. Reynell M (1990) Thermal analysis using computational fluid dynamics. Electron Packag Prod
2. Chu RC, Simons RE, Ellsworth MJ, Schmidt RR, Cozzolino V (2004) Review of cooling technologies for computer products. IEEE Trans Device Mater Reliab 4(4):568–585
3. Incropera FP, DeWitt DP (2006) Introduction to heat transfer. Wiley, Hoboken, NJ
4. Holman JP (2009) Heat transfer. McGraw-Hill, New York
5. Yeh L-T, Chu RC (2002) Thermal management of microelectronic equipment: heat transfer theory, analysis methods and design practices. ASME, New York
Cited by
1 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17