Physics of Failure Based Reliability Assessment of Electronic Hardware
Author:
Publisher
Springer London
Link
http://link.springer.com/content/pdf/10.1007/978-1-4471-4993-4_23
Reference13 articles.
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3. Vandevelde B, Gonzaleza M, Limayea P, Ratcheva P, Beynea E (2007) Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages. Microelectron Reliab 47(2–3):259–265
4. Lall P, Gupte S, Choudhary P, Suhling J (2007) Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling. IEEE Trans Electron Packag Manuf 30(1):74–83
5. Osterman M, Stadterman T (1999) Failure assessment software for circuit card assemblies. Annual proceedings of the reliability and maintainability symposium, 269–276
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