Electrochemical Fabrication Process for ULSI Interconnects
Author:
Publisher
Springer New York
Link
http://link.springer.com/content/pdf/10.1007/978-1-4419-1424-8_15
Reference33 articles.
1. Andricacos PC, Uzoh C et al (1998) Damascene copper electroplating for chip interconnections. IBM J Res Dev 42:567–574
2. Andricacos PC (1999) Copper on-chip interconnections a breakthrough in electrodeposition to make better chips. Electrochem Soc Interface 8:32–37
3. Ismail YI, Friedman EG et al (2001) Exploiting the on-chip inductance in high-speed clock distribution networks. IEEE Trans Very Large Scale Integr (VLSI) Syst 9:963–973
4. Deutsch A, Kopcsay GV et al (2001) Frequency-dependent losses on high-performance interconnections. IEEE Trans Electromagn Compat 43:446–465
5. Ismail YI et al (2001) Repeater insertion in tree structured inductive interconnect. IEEE Trans Circuits Syst II – Analog Digit Signal Process 48:471–481
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