A profilometric study of levelling in electroplating-Reference-Cited by-同舟云学术

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A profilometric study of levelling in electroplating

Published:1984-01 Issue:1 Volume:14 Page:83-90
ISSN:0021-891X
Container-title:Journal of Applied Electrochemistry
language:en
Short-container-title:J Appl Electrochem

Author:

Tidke D. J.,Ramaswamy N.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrochemistry,General Chemical Engineering

Link

http://link.springer.com/content/pdf/10.1007/BF00611262.pdf

Reference14 articles.

1. E. B. Leffler and H. Leidheiser Jr,Plating 44 (1957) 388.

2. O. Kardos and D. G. Foulke, ?Advances in Electrochemistry and Electrochemical Engineering?, Vol. 2, Interscience Pub., London (1966) p. 145.

3. O. Kardos,Plating 61 (1974) 129.

4. W. A. Crichton, J. A. McGeough and J. R. Thomson,J. Mech. Eng. Sci. 22 (1980) 49.

5. F. I. Nobel and B. D. Ostrow,Plating 42 (1954) 892.

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