Variables affecting the wetting of tinplate by Sn-Pb solders-Reference-Cited by-同舟云学术

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Variables affecting the wetting of tinplate by Sn-Pb solders

Published:1971-12 Issue:1 Volume:2 Page:103-111
ISSN:0360-2133
Container-title:Metallurgical Transactions
language:en
Short-container-title:MT

Author:

Budrys R. S.,Brick R. M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics,Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/BF02662643.pdf

Reference27 articles.

1. H. H. Manko:Solders and Soldering, McGraw-Hill Book Co., New York, 1964.

2. D. R. Milner:Brit, Welding J., 1958, March, p. 90.

3. S. L. J. Bailey and H. C. Watkins:J Inst. Metals, 1951-52, vol. 80, p. 57.

4. S. Glasstone:Textbook of Physical Chemistry, 2nd ed., pp. 481–87, D. Van Nostrand Co., New York, 1946.

5. A. Latin:J Inst. Metals, 1946, vol. 72, p. 265.

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimal conditions for the wetting balance test;Journal of Materials Processing Technology;2009-03

2. Measurement of Wetting of Copper by Liquid Mercury with Meniscograph;Materials Transactions, JIM;1989

3. Interfacial energies in low melting point metals;Materials Science and Engineering;1985-01

4. Wetting Characteristics of Low Carbon Rimmed Steel with Molten Zinc;Tetsu-to-Hagane;1982

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