Electrical characterization and performance analysis of coaxial through-glass vias
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s12046-023-02392-w.pdf
Reference15 articles.
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3. Yousuf Bin H A, Hossain M N and Chowdhury H M 2015 Performance analysis of through-silicon via (TSV) and through glass via (TGV) for different materials. In: IEEE International Symposium on Circuits and Systems (ISCAS), Lisbon, Portugal, pp. 1957–1960
4. Kim J, Hwang I, Kim Y, Cho J, Sundaram V and Tummala R et al 2015 Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC. In: IEEE 65th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, pp. 254–259
5. Shorey B A and Lu R 2016 Progress and application of through glass via (TGV) technology. In: Pan Pacific Microelectronics Symposium (Pan Pacific), Big Island, HI, USA, pp. 1–6
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