Author:
Gajarska Zuzana,Brunnbauer Lukas,Lohninger Hans,Limbeck Andreas
Publisher
Springer International Publishing
Reference93 articles.
1. Plastics Europe. Plastics–the facts 2019; 2019.
2. Bart JCJ. Additives in polymers: industrial analysis and applications. New York: Wiley; 2005.
3. Akovali G. Polymers in construction. Shawbury: Rapra Technology; 2005.
4. Kinjo N, Ogata M, Nishi K, Kaneda A, Dušek K. Epoxy molding compounds as encapsulation materials for microelectronic devices. In: Speciality polymers/polymer physics. Berlin: Springer; 1989.
5. Sasajima H, Watanabe I, Takamoto M, Dakede K, Itoh S, Nishitani Y, Tabei J, Mori T. New development trend of epoxy molding compound for encapsulating semiconductor chips. In: Materials for advanced packaging. Cham: Springer; 2017. p. 373.
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献