Fast EM Immortality Analysis for Multi-Segment Copper Interconnect Wires
Author:
Publisher
Springer International Publishing
Link
http://link.springer.com/content/pdf/10.1007/978-3-030-26172-6_4
Reference28 articles.
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4. J.R. Black, Electromigration-a brief survey and some recent results. IEEE Trans. Electron Devices 16(4), 338–347 (1969)
5. I.A. Blech, Electromigration in thin aluminum films on titanium nitride. J. Appl. Phys. 47(4), 1203–1208 (1976)
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