Physical and Numerical Modeling of Micro-extrusion Behavior of AA3xxx Aluminum Alloy in Cold Roll Bonding
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Publisher
Springer Nature Switzerland
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-41023-9_30
Reference17 articles.
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4. Güley, V., Güzel, A., Jäger, A., Khalifa, N.B., Tekkaya, A.E., Misiolek, W.Z.: Effect of die design on the welding quality during solid state recycling of AA6060 chips by hot extrusion. Mater. Sci. Eng. A 574, 163–175 (2013)
5. Bay, N., Clemensen, C., Juelstorp, O., Wanheim, T.: Bond strength in cold roll bonding. CIRP Ann. 34(1), 221–224 (1985)
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