Plasma Parameters with Respect to Material Processing
Author:
Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-02035-3_3
Reference5 articles.
1. Baranov, O., Xu, S., Ostrikov, K., Wang, B. B., Cvelbar, U., Bazaka, K., and Levchenko, I. 2018. Towards universal plasma-enabled platform for the advanced nanofabrication: Plasma physics level approach, Rev. Mod. Plasma Phys., 2:4. DOI: 10.1007/s41614-018-0016-7. 23
2. Seo, D. H., Rider, A. E., Arulsamy, A. D., Levchenko, I., and Ostrikov, K. 2010. Increased size selectivity of Si quantum dots on SiC at low substrate temperatures: An ion-assisted self-organization approach. J. Appl. Phys., 107:024313. DOI: 10.1063/1.3284941. 23
3. Lieberman, M. A. and Lichtenberg, A. J. 2005. Principles of Plasma Discharges for Materials Processing, New York, Wiley. DOI: 10.1002/0471724254. 23
4. Luo, K., Zhang, Q Yuan, H., Liu, Y., Wang, X., Zhang, J., Hu, W., Xu, M., Xu, S., Levchenko, I., and Bazaka, K. 2020. Facile synthesis of Ag/Zni_x Cux O nanopar-ticle compound photocatalyst for high-efficiency photocatalytic degradation: Insights into the synergies and antagonisms between Cu and Ag, Ceram. Int., 46, (in press). DOI: 10.1016/j.ceramint.2020.06.102. 24
5. Filipic, G., Baranov, O., Mozetic, M., Ostrikov, K., and Cvelbar, U. 2014. Uniform surface growth of copper oxide nanowires in radiofrequency plasma discharge and limiting factors, Phys. Plasmas, 21:113506. DOI: 10.1063/1.4901813. 25
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