Author:
Chayoukhi Slah,Abid Mohamed,Jouini Insaf,Mansouri Jed,Zghal Ali
Publisher
Springer International Publishing
Reference10 articles.
1. Fei, X., et al.: Electrodynamic mini flat heat pipe for advanced electronics cooling. Interfacial Phenom. Heat Transf., 43–59 (2021). https://doi.org/10.1615/InterfacPhenomHeatTransfer.2021035300
2. Shiwei, Z., Jieling, C., et al.: Experimental study on the thermal performance of a novel ultra-thin aluminum flat heat pipe. Renew. Energy 135, 1133–1143 (2019)
3. Fei, X., Ting, M., Qiuwang, W.: Thermal performance analysis of flat heat pipe with graded mini-grooves wick. Appl. Energy 228, 2129–2139 (2018)
4. Xianbing, J., Hongchuan, L., Jinliang, X., Yanping, H.: Integrated flat heat pipe with a porous network wick for high-heat-flux electronic devices. Exp. Thermal Fluid Sci. 85, 119–131 (2018)
5. Yanhua, D., Yameng, K., Lin, L., Yaohua, Z., Tingting, Z.: Experimental investigation on the heat transfer performance of a latent thermal energy storage device based on flat miniature heat pipe arrays. Energy 138, 929–941 (2017)