Wire Bonding: Limitations and Opportunities for High-Speed Serial Communications
Author:
Publisher
Springer Nature Switzerland
Link
https://link.springer.com/content/pdf/10.1007/978-3-031-48121-5_3
Reference14 articles.
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3. Monda D, et al (2021) Design and verification of a 6.25 GHz LC-tank VCO integrated in 65 nm CMOS technology operating up to 1 Grad TID. IEEE TNS 68(10):2524–2532
4. Božani´c M, et al (2019) Systems-level packaging for millimeter-wave transceivers. Springer, Vienna, Austria
5. Chang PH, et al (2021) Signal and power integrity analysis of a 0.38 pJ/bit 12.8 Gb/s parallel interface for die-to-die link applications. In: 2021 ECTC, CA, USA, pp 1264–1269
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