Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi
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Publisher
Springer International Publishing
Link
https://link.springer.com/content/pdf/10.1007/978-3-030-93441-5_7
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4. Alvarez, P., Ribotta, S., Folquer, M., Gervasi, C., & Vilche, J. (2002). Potentiodynamic behaviour of tin in different buffer solutions. Corrosion Science, 44(1), 49–65.
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1. The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles;Journal of Polytechnic;2023-08-15
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