MTConnect and Digital Twin Applications and Future Perspectives

Author:

M. Sharadah Fathi,Al-Dubaee Shawki,Weir George

Publisher

Springer International Publishing

Reference67 articles.

1. Al-Dubaee, S., Juneja, J.: An affordable portable IoT development kit and I4.0 platform an internal report of Advanced Forming Research Centre (AFRC), DMEM, Strathclyde University, Scotland (2020)

2. Lu, Y., Liu, C., Wang, K.-K., Huang, H., Xu, X.: Digital Twin-driven smart manufacturing: connotation, reference model, applications and research issues. Robot. Comput. Integr. Manuf. 61, 1–14 (2020)

3. Zhong, R.Y., Xu, X., Klotz, E., Newman, S.T.: Intelligent manufacturing in the context of industry 4.0: a review. Engineering 3(5), 616–630 (2017)

4. Fisher, R., Shao, G.: Testing of the MTConnect-OPC UA Compnation Specification. Erie, PA, USA (2019)

5. Bamunuarachchi, D., Banerjee, A., Jayaraman, P.P., Georgakopoulos, D.: Cyber Twins Supporting Industry 4.0 Application Development. Chiang Mai, Thailand, ACM, New York, USA (2020)

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